MHHPA is a thermosetting Epoxy curing agent, mainly used in the field of electronics and electricity fields. MHHPA obtains following advantage when used in the Epoxy compounds:
- Low melting points
- Low viscosity of the mixtures with alicyclic Epoxy resin
- Long applicable period(pot life)
- High heat resistance of the cure materials
- Excellent electrical properties at high temperature
Chemicals information:
CAS NO:19438-60-9, 85-42-7
Formula: C9H12O3
Molecular weight: 168.19
Specifications:
| Item | Specifications |
| Appearance | Colorless liquid |
| Iodine Value | 1.0 max |
| Viscosity(25c) mPa.s | 50-70 |
| Free Acid, % | 1.0% max |
| Freezing points © | -15C max |
| Specific Gravity, g/cm3 | 1.162 |
Applications:
- Impregnating electrical coils
- Casting electricity components
- Encapsulation of semiconductor
- Out door insulator, capacitor, LED and digital displayer
